An integrated approach to optimize solder joint reliability

Summary

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Authors: Alessandro Sitta, Sebastiano Russo, Marco Torrisi, Angelo Alberto Messina, Giuseppe D'Arrigo, Gaetano Sequenzia, Marco Renna, Michele Calabretta

Journal title: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Journal publisher: IEEE

Published year: 2020

Published pages: 1-5

DOI identifier: 10.1109/eurosime48426.2020.9152688

ISBN: 978-1-7281-6049-8