Power Module Ceramic Substrates: mechanical characterization and modeling

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Alessandro Sitta, Marco Renna, Angelo Alberto Messina, Giuseppe Mirone, Giuseppe D'Arrigo, Michele Calabretta

Journal title: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Journal publisher: IEEE

Published year: 2020

Published pages: 1-5

DOI identifier: 10.1109/eurosime48426.2020.9152670

ISBN: 978-1-7281-6049-8