Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS Mirror

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Authors: Henri Ailas, Jaakko Saarilahti, Tuomas Pensala, Jyrki Kiihamaki

Journal title: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

Journal publisher: IEEE

Published year: 2019

Published pages: 12-16

DOI identifier: 10.23919/nordpac.2019.8760353

ISBN: 978-91-519-2090-0