Impact Of Repetitive UIS And SC Stress On Degradation Of Power SIC TrenchMosfets

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Authors: J. Marek, J. Kozarik, A. Chvala, M. Minarik, P. Spanik, M. Jagelka, D. Donoval, M. Donoval

Journal title: 2020 13th International Conference on Advanced Semiconductor Devices And Microsystems (ASDAM)

Journal publisher: IEEE

Published year: 2020

Published pages: 92-95

DOI identifier: 10.1109/asdam50306.2020.9393845

ISBN: 978-1-7281-9776-0