A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance Within Active Flexible Implants

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Authors: Omer Can Akgun, Kambiz Nanbakhsh, Vasiliki Giagka, Wouter A. Serdijn

Journal title: 2019 IEEE Biomedical Circuits and Systems Conference (BioCAS)

Journal publisher: IEEE

Published year: 2019

Published pages: 1-4

DOI identifier: 10.1109/biocas.2019.8919203

ISBN: 978-1-5090-0617-5