Long-term Encapsulation of Platinum Metallization Using a HfO 2 ALD - PDMS Bilayer for Non-hermetic Active Implants

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Authors: Kambiz Nanbakhsh, Riina Ritasalo, Wouter A. Serdijn, Vasiliki Giagka

Journal title: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Journal publisher: IEEE

Published year: 2020

Published pages: 467-472

DOI identifier: 10.1109/ectc32862.2020.00081

ISBN: 978-1-7281-6180-8