Chip package bumping on wafer level for RDL first Fan-Out wafer

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Anshuma Pathak, Mathias Böttcher, Sebastiaan Kersjes, Thomas Oppert, Thorsten Teutsch

Journal title: IMAPS Device Packaging 2021

Journal publisher: IMAPS Device Packaging 2021

Published year: 2021