The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods

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Authors: Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes

Journal title: ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Journal publisher: American Society of Mechanical Engineers

Published year: 2020

DOI identifier: 10.1115/ipack2020-2555

ISBN: 978-0-7918-8404-1