Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line

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Authors: Ghanshyam Gadhiya, Heikki Kuisma, Andre Cardoso, Birgit Bramer, Sven Rzepka, Thomas Otto

Journal title: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Journal publisher: IEEE

Published year: 2020

Published pages: 1-8

DOI identifier: 10.1109/eurosime48426.2020.9152629

ISBN: 978-1-7281-6049-8