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Authors: Emre Topal, Jurgen Gluch, Andre Clausner, Andre Cardoso, Ehrenfried Zschech
Journal title: IEEE Transactions on Components, Packaging and Manufacturing Technology
Journal number: 11/3
Journal publisher: Institute of Electrical and Electronics Engineers Inc.
Published year: 2021
Published pages: 504-509
DOI identifier: 10.1109/tcpmt.2020.3048672
ISSN: 2156-3950