Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions

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Authors: Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka

Journal title: 2018 7th Electronic System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2018

Published pages: 1-7

DOI identifier: 10.1109/estc.2018.8546352

ISBN: 978-1-5386-6814-6