Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices

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Authors: Ayad Ghannam, Niek van Haare, Julian Bravin, Elisabeth Brandl, Birgit Brandstatter, Hannes Klingler, Benedikt Auer, Philippe Meunier, Sebastiaan Kersjes

Journal title: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Journal publisher: IEEE

Published year: 2019

Published pages: 1789-1795

DOI identifier: 10.1109/ectc.2019.00276

ISBN: 978-1-7281-1499-6