Assessment of FOWLP process dependent wafer warpage using parametric FE study

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Authors: Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka, Thomas Otto

Journal title: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Journal publisher: IEEE

Published year: 2019

Published pages: 1-8

DOI identifier: 10.23919/empc44848.2019.8951805

ISBN: 978-0-9568086-6-0