Reliability of Fan-Out Wafer Level Packaging For III-V RF Power MMICs

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Authors: Ariane Tomas, Laurent Marechal, Rodrigo Almeida, Mehdy Neffati, Nathalie Malbert, Helene Fremont, Nathalie Labat, Arnaud Garnier

Journal title: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Journal publisher: IEEE

Published year: 2021

Published pages: 1779-1785

DOI identifier: 10.1109/ectc32696.2021.00281

ISBN: 978-1-6654-4097-4