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Authors: Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Journal title: ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Journal publisher: American Society of Mechanical Engineers
Published year: 2018
DOI identifier: 10.1115/ipack2018-8256
ISBN: 978-0-7918-5192-0
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