System in package embedding III-V chips by fan-out wafer-level packaging for RF applications

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Authors: Arnaud Garnier, Laetitia Castagne, Florent Greco, Thomas Guillemet, Laurent Marechal, Mehdy Neffati, Remi Franiatte, Perceval Coudrain, Stephane Piotrowicz, Gilles Simon

Journal title: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Journal publisher: IEEE

Published year: 2021

Published pages: 2016-2023

DOI identifier: 10.1109/ectc32696.2021.00318

ISBN: 978-1-6654-4097-4