Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

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Authors: Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet

Journal title: Journal of Electronic Packaging

Journal number: 141/3

Journal publisher: ASME

Published year: 2019

DOI identifier: 10.1115/1.4043477

ISSN: 1043-7398