Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

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Authors: Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl, Alfred Binder

Journal title: Energies

Journal number: 14/8

Journal publisher: Multidisciplinary Digital Publishing Institute (MDPI)

Published year: 2021

Published pages: 2176

DOI identifier: 10.3390/en14082176

ISSN: 1996-1073