Influence of Lateral Temperature Gradients on the Failure Modes at Power Cycling

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Authors: Xing Liu, Erping Deng, Hao Wang, Clemens Herrmann, Thomas Basler, Josef Lutz

Journal title: IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal number: 11/3

Journal publisher: Institute of Electrical and Electronics Engineers Inc.

Published year: 2021

Published pages: 407-414

DOI identifier: 10.1109/tcpmt.2021.3058201

ISSN: 2156-3950