Methodology for multi-die package semiconductors: Thermal Model in a Dynamic Environment

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Authors: J. M. Baron, X. Mo, P. Alou, M. Vasic; F. Vergara, P. J. Arnaiz

Journal title: IWED 2021, , 29 January

Journal publisher: 28th International Workshop on Electric Drives: Improving Reliability of Electric Drives

Published year: 2021