Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Xia, A. Roy, E. Bardalen, H. -V. Nguyen, K. E. Aasmundtveit and P. Ohlckers

Journal title: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Journal publisher: IEEE

Published year: 2021

DOI identifier: 10.23919/empc53418.2021.9584992