Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

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Authors: Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger

Journal title: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2020

Published pages: 1-5

DOI identifier: 10.1109/estc48849.2020.9229696

ISBN: 978-1-7281-6293-5