Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds

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Authors: P. Papatzacos, N. Tiwary, N. Hoivik, H. V. Nguyen, A. Roy, and K. E. Aasmundtveit

Journal title: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021

Journal publisher: IEEE

Published year: 2021

DOI identifier: 10.23919/empc53418.2021.9584990