Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel

Journal title: Journal of Electronic Materials

Journal publisher: Institute of Electrical and Electronics Engineers

Published year: 2020

DOI identifier: 10.1007/s11664-020-08530-y

ISSN: 0361-5235