Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays

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Authors: Hexin Xia, Muhammad Nadeem Akram, Avisek Roy, Eivind Bardalen, Hoang-Vu Nguyen,Nils Høivik, Knut Eilif Aasmundtveit and Per Ohlckers

Journal title: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. December 2021. (Early access)

Journal publisher: Institute of Electrical and Electronics Engineers Inc.

Published year: 2021

DOI identifier: 10.1109/tcpmt.2021.3135081

ISSN: 2156-3950