Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays

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Authors: Hexin Xia, Muhammed Nadeem Akram, Eivind Bardalen, Avisek Roy, Knut Eilif Aasmundtveit, Per Ohlckers

Journal title: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2020

Published pages: 1-5

DOI identifier: 10.1109/estc48849.2020.9229710

ISBN: 978-1-7281-6293-5