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Authors: Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Ross Glenn, Mervi Paulasto-Kröckel
Journal title: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021
Journal publisher: IEEE
Published year: 2021
DOI identifier: 10.23919/empc53418.2021.9585007
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