Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger

Journal title: IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal publisher: Institute of Electrical and Electronics Engineers Inc.

Published year: 2021

Published pages: 1-1

DOI identifier: 10.1109/tcpmt.2021.3111345

ISSN: 2156-3950