Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

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Authors: J. Zundel, M. Sagerer, M. Frewein, T. Krivec

Journal title: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Journal publisher: IEEE

Published year: 2021

Published pages: 1-7

DOI identifier: 10.1109/eurosime52062.2021.9410833

ISBN: 978-1-6654-1373-2