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Authors: Willem D. van Driel, B. Jacobs, P. Watte, X. Zhao
Journal title: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2021
Published pages: 1-4
DOI identifier: 10.1109/eurosime52062.2021.9410861
ISBN: 978-1-6654-1373-2
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