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Authors: M. Frewein; S. Stojanovic; Q. Tao; T. Krivec; J. Zuendel; M. Goessler; P. F. Fuchs; M. Gschwandl
Journal title: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2022
DOI identifier: 10.1109/eurosime54907.2022.9758866
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