Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress

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Authors: Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Kröckel

Journal title: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 12, NO. 5, MAY 2022

Journal publisher: Institute of Electrical and Electronics Engineers Inc.

Published year: 2022

DOI identifier: 10.1109/tcpmt.2022.3170082

ISSN: 2156-3950