A High-Power SOI-CMOS PA Module with Fan-Out Wafer-Level Packaging for 2.4 GHz Wi-Fi 6 Applications

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Authors: P. Reynier; A. Serhan; D. Parat; R. Mourot; M. Gaye; P. Kauv; A. Cardoso; A. Gouvea; S. Nogueira; A. Giry

Journal publisher: RFIC 2021 Conference

Published year: 2021