IC and Package Co-design Techniques & Technologies for High Efficiency Linear PA Modules

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Authors: P. Reynier, A. Serhan, D. Parat, A. Giry

Journal title: "Workshop ""Fully Integrated Silicon vs. Hybrid RFFE Systems for mm-Wave 5G Highly Efficient PA Design Trade-offs"""

Journal publisher: RFIC 2021 Workshop

Published year: 2021