Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

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Authors: Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel

Journal title: Scripta Materialia, Volume 222, 1 January 2023, 114998

Journal publisher: Pergamon Press Ltd.

Published year: 2023

DOI identifier: 10.1016/j.scriptamat.2022.114998

ISSN: 1359-6462