"Evaluating Cu Printed Interconnects ""Sinterconnects"" versus Wire Bonds for Switching Converters"

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Authors: Md. N. Hasan, T. Polom, D. Holzmann, P. Malago, A. Binder, A. Roshanghias

Journal title: electronis

Journal number: 11

Journal publisher: MDPI

Published year: 2022

DOI identifier: 10.3390/electronics11091373

ISSN: 2079-9292