Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study

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Authors: D. Hu, Z. Cui, J. Fan, X. Fan, G. Zhang

Journal title: Results in Physics

Journal number: 19

Journal publisher: Elsevier

Published year: 2020

DOI identifier: 10.1016/j.rinp.2020.103486

ISSN: 2211-3797