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Authors: J. Leppänen, J. Ingman, J.-H. Peters, M. Hanf, R. Ross, G. Koopmans, J. Jormamainen, A. Forsström, G. Ross, N. Kaminski, V. Vuorinen
Journal title: Microelectronics Reliability
Journal number: Volume 137
Journal publisher: Elsevier BV
Published year: 2022
DOI identifier: 10.1016/j.microrel.2022.114776
ISSN: 0026-2714
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