Co-Simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro

Journal title: 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation

Journal publisher: EuroSimE

Published year: 2020