Methodology for multi-die package semiconductor Termal Model in a Dynamic Environment

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Authors: J. M. Baron, G. Salinas, X. Mo, F. Vergara, P. J. Arnaiz, P. Alou, M. Vasic

Journal title: 28th International Workshop on Electric Drives: Improving Reliability of Electri Drives

Journal publisher: IEEE Explore

Published year: 2021

DOI identifier: 10.1109/iwed52055.2021.9376341