High speed thermal mapping on six-pack SiC-based module for hybrid and electric vehicles

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Authors: G. Malta, L. Anoldo, B. Mazza, G. G. Piccione, A. Russo, M. Calabretta, S. Russo, A. Sitta, A. Messina, A. Lionetto, S.

Journal publisher: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Published year: 2022

DOI identifier: 10.1109/eurosime54907.2022.9758858