Presentation: Intelligent Manufacturing – From the Chip – Package – Board/System: Impact on reliability

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Klaus Pressel

Journal title: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2022