Improving the production quality and robustness of a SO16 sensor package by a simulation based digital twin approach

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Authors: H. Moeller, H. Knoll, P. Hille, R. Dudek and S. Rzepka

Journal title: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/estc55720.2022.9939391