Feasibility of Wafer Exchange for European Edge AI Pilot Lines

Summary

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Authors: A.F. Wandesleben, D. Truffier-Boutry, V. Brackmann, B. Lilienthal-Uhlig, M. Jaysnkar, S. Beckx, I. Madarevic, A. Demarest, B. Hintze, F. Hochschulz, Y. Le Tiec, A. Spessot, F. Nemouchi

Journal title: Industrial Artificial Intelligence Technologies and Applications

Journal publisher: River Publishers

Published year: 2022