High-density 3D monolithically integrated multiple 1T1R multi-level-cell for neural networks

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Authors: E. Esmanhotto, L. Brunet, N. Castellani, D. Bonnet, T. Dalgaty, L. Grenouillet, D.R.B Ly, C. Cagli, C. Vizioz, N. Allouti, F. Laulagnet, O. Gully, N. Bernard-Henriques, M. Bocquet, G. Molas, P. Vivet, D. Querlioz, J.M. Portal, S. Mitra, F. Andrieu, C. Fenouillet-Beranger, E. Nowak, E. Vianello

Journal title: IEEE International Electron Devices Meeting (IEDM)

Journal publisher: IEEE

Published year: 2020

DOI identifier: 10.1109/iedm13553.2020.9372019