Vacuum Packaging of MEMS-based Infrared Detectors

Summary

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Authors: Avisek Roy; Hoang-Vu Nguyen; Hexin Xia; Phillip Papatzacos; Per Ohlckers; Knut Eilif Aasmundtveit

Journal title: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/estc55720.2022.9939461