Squeeze-out and bond strength of patterned Cusingle bondSn SLID seal-frames

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Authors: Papatzacos, P. H., Nguyen, H. V., Roy, A., Hoivik, N., Broaddus, P., & Ohlckers, P.

Journal title: Microelectronics Reliability

Journal publisher: Elsevier BV

Published year: 2022

DOI identifier: 10.1016/j.microrel.2022.114692

ISSN: 0026-2714