Failure analysis of fabrication process in hermetic wafer-level packaging for microbolometer focal plane arrays

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Authors: H. Xia, A. Roy, H.-V. Nguyen, Z. Ramic, K.E. Aasmundtveit, P. Ohlckers

Journal title: Microelectronics Reliability

Journal publisher: Elsevier BV

Published year: 2022

DOI identifier: 10.1016/j.microrel.2022.114712

ISSN: 0026-2714