Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

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Authors: L. Du, X. Zhao, P. Watté, R. Poelma, W. Van Driel and G. Zhang

Journal title: 48th Annual Conference of the IEEE Industrial Electronics Society

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/iecon49645.2022.9968578