Deformation measurement on cross sections of Fan-Out Wafer Level Package by Digital Image Correlation (DIC)

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Authors: I. Maus, P. Altieri–Weimar, W. Hartner, M. Niessner and B. Bäumer

Journal title: IEEE 9th Electronics System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/estc55720.2022.9939400

ISBN: 978-1-6654-8948-5